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Insulating gas hitachi abb power grids Decomposition electronic weighing device

Processing, characterization and modelling of borosilicate ... issue of electronic device cooling is very involved. As chip integration evolves, switching elements are placed with increasing density. While per device power dissipation has steadily decreased, the rate of decrease of microdevice separation has surpassed this effect (see Figures 1.5, 1.6 and 1.7). As a result advanced ICs have cooling

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